
Automated Optical Inspection
Inline 3D AOI on every SMT line. Detects solder defects, component placement errors, and polarity issues in real time with high-resolution cameras.
Every board leaves our facility tested, verified, and traceable. Our multi-stage quality system catches issues before they become yours.

Our quality management system is built on international standards, independently audited, and continuously improved.
From incoming components to final functional test — every inspection point is a gate that must be passed.

Inline 3D AOI on every SMT line. Detects solder defects, component placement errors, and polarity issues in real time with high-resolution cameras.

Non-destructive BGA, QFN, and hidden-joint inspection. Verifies solder ball integrity, void percentage, and pad wetting beneath components.

In-Circuit Testing verifies component values and connections. Functional test fixtures simulate real-world operation to validate full board performance.
Our 7-stage quality process ensures consistent, defect-free output from incoming materials to final shipment.
All components and PCBs inspected against BOM and IPC standards before release to production.
Solder Paste Inspection after printing verifies volume, area, and height of paste deposits before placement.
First board off every line is fully inspected before volume production begins.
Every board passes through 3D AOI after reflow. Defects flagged and quarantined immediately.
BGA and hidden-joint X-ray inspection per AQL sampling plan or 100% for Class 3 products.
100% electrical and functional testing on custom fixtures. Every board powered up and verified.
Need IPC Class 3? Full traceability? Custom test plans? We'll engineer a quality process that matches your specifications.